Advanced Features & Core Technology
Innovation that ensures superior performance and process reliability.
Integrated Magnetic Annealing Solutions
Loading System Flexibility
- **Bottom Loading (BL):** Ideal for Perpendicular Magnetization. Ensures high stability and precise handling.
- **Side Loading (SL):** Optimized for In-plane Magnetization. Offers easier maintenance and system integration.
- **Versatility:** Supports both 8-inch and 12-inch wafers with optimized transfer mechanisms.
Advanced Magnet Field Control
- **Field Types:** Supports Permanent Magnet (up to 1T), ElectroMagnet, and Super-conducting Magnet (up to 5T).
- **Magnetization Directions:** Capable of precise Perpendicular (PMA) and In-plane (IMA) annealing processes.
- **Customization:** Magnet type selection is tailored to meet specific application and wafer requirements.
Key Technical Specifications
Furnace Performance
500°C
Maximum Annealing Temperature
Wafer Compatibility
8" & 12"
Supported Wafer Sizes (Industry Standard)
Process Quality
High Uniformity
Ensured magnetic and thermal uniformity across the wafer.
Proprietary Magnetic Annealing Technology
FD&S's core technology focuses on controlling the most critical parameters: Temperature, Vacuum, and Magnetic Field.
1. High-Stability Furnace Design
Our vacuum furnace is engineered for maximum thermal stability and rapid cycling. We ensure temperature uniformity better than standard specifications, which is crucial for achieving consistent magnetic properties across large-diameter wafers.
2. Precision Vacuum System
The integrated vacuum pumping system achieves ultra-high vacuum levels necessary to prevent oxidation and contamination during the high-temperature annealing process. Real-time vacuum monitoring ensures process integrity.
3. Optimized Magnet Field Uniformity
Whether using Permanent, Electro, or Super-conducting magnets, the magnetic field is meticulously mapped and controlled. Specialized shimming techniques guarantee field homogeneity, directly contributing to the yield and quality .